Semiconductor memory systems with on-die data buffering

ABSTRACT

A semiconductor memory system includes a first semiconductor memory die and a second semiconductor memory die. The first semiconductor memory die includes a primary data interface to receive an input data stream during write operations and to deserialize the input data stream into a first plurality of data streams, and also includes a secondary data interface, coupled to the primary data interface, to transmit the first plurality of data streams. The second semiconductor memory die includes a secondary data interface, coupled to the secondary data interface of the first semiconductor memory die, to receive the first plurality of data streams.

RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No. 14/023,970, filed Sep. 11, 2013, entitled SEMICONDUCTOR MEMORY SYSTEMS WITH ON-DIE DATA BUFFERING, and which claims the benefit of priority under 35 U.S.C. 119(e) to Provisional Application Ser. No. 61/714,666, filed Oct. 16, 2012, entitled SEMICONDUCTOR MEMORY SYSTEMS WITH ON-DIE DATA BUFFERING, which is incorporated herein by reference in its entirety for all purposes.

TECHNICAL FIELD

The present embodiments relate generally to semiconductor memories, and specifically to semiconductor memories with on-die data buffering.

BACKGROUND

The storage capacity of a semiconductor memory system can be increased by increasing the number of semiconductor memory die in the system. Increasing the number of semiconductor memory die, however, presents significant engineering challenges. For example, increasing the number of die coupled to a signal line in a data bus increases the capacitive loading (e.g., the pin capacitance) for the signal line and thus decreases the maximum rate at which data can be transmitted over the signal line.

Accordingly, there is a need for effective techniques for buffering data transmission in a semiconductor memory system.

BRIEF DESCRIPTION OF THE DRAWINGS

The present embodiments are illustrated by way of example and are not intended to be limited by the figures of the accompanying drawings.

FIG. 1 is a block diagram of a semiconductor memory system that includes a semiconductor memory die configured as a master memory die and one or more semiconductor memory die configured as slave memory die in accordance with some embodiments.

FIGS. 2A and 2B are cross-sectional views of systems in which multi-die packages are stacked in a package-on-package (POP) configuration and mounted on a module substrate in accordance with some embodiments.

FIG. 2C is a cross-sectional view of a system in which a single package that includes eight memory die is mounted on a module substrate in accordance with some embodiments.

FIGS. 2D and 2E are cross-sectional views of systems in which multi-die packages are situated in different locations on a module substrate in accordance with some embodiments.

FIGS. 2F and 2G are cross-sectional views of systems in which single-die packages are situated in different locations on a module substrate in accordance with some embodiments.

FIG. 3 is a block diagram of a system in which semiconductor packages containing semiconductor memory die are mounted on a module in accordance with some embodiments.

FIG. 4A is a schematic diagram of a system in which two memory die are stacked on a package substrate that is mounted on a module substrate in accordance with some embodiments.

FIG. 4B is a schematic diagram of a system in which a master memory die is stacked with a slave memory die on a package substrate and coupled to slave memory die stacked on another package substrate in accordance with some embodiments.

FIG. 5A is a cross-sectional view illustrating wire-bonding in a semiconductor package with stacked memory die in accordance with some embodiments.

FIGS. 5B and 5C are cross-sectional views illustrating wire-bonding in semiconductor memory systems in accordance with some embodiments.

FIG. 5D is a cross-sectional view of a semiconductor memory system in which stacked memory die are coupled using through-die vias in accordance with some embodiments.

FIGS. 6A and 6B are cross-sectional exploded views of bond pads and pins associated with primary and secondary data interfaces in a POP configuration in accordance with some embodiments.

FIG. 7 is an exploded plan view of a POP configuration in accordance with some embodiments.

FIG. 8 is a cross-sectional view of a POP configuration that includes non-functional die in accordance with some embodiments.

FIGS. 9A-9C are block diagrams showing write-path circuitry of a system in which a master memory die transmits a data strobe to slave memory die along with buffered data during write operations, in accordance with some embodiments.

FIG. 10 shows timing diagrams for write operations in the system of FIGS. 9A-9C in accordance with some embodiments.

FIGS. 11A-11C are block diagrams showing read-path circuitry of a system in which a slave memory die transmits a data strobe to a master memory die along with data during read operations, in accordance with some embodiments.

FIG. 12 shows timing diagrams for read operations in the system of FIGS. 11A-11C in accordance with some embodiments.

FIGS. 13A and 13B illustrate write and read paths in systems in which both the master memory die and slave memory die include delay-locked loops (DLLs) in accordance with some embodiments.

FIGS. 14A and 14B illustrate write paths in systems in which the master memory die includes a DLL in accordance with some embodiments.

FIGS. 15A and 15B illustrate write paths in systems in which a slave memory die includes one or more controlled delay elements in accordance with some embodiments.

FIG. 16A is a flowchart of a method of performing write operations in a memory system in accordance with some embodiments.

FIG. 16B is a flowchart of a method of performing read operations in a memory system in accordance with some embodiments.

Like reference numerals refer to corresponding parts throughout the drawings and specification.

DETAILED DESCRIPTION

Embodiments are disclosed in which a first semiconductor memory die, referred to as a master memory die, buffers data for a second semiconductor memory die, referred to as a slave memory die.

In some embodiments, a semiconductor memory system includes a first semiconductor memory die and a second semiconductor memory die. The first semiconductor memory die includes a primary data interface to receive an input data stream during write operations and to deserialize the input data stream into a first plurality of data streams, and also includes a secondary data interface, coupled to the primary data interface, to transmit the first plurality of data streams. The second semiconductor memory die includes a secondary data interface, coupled to the secondary data interface of the first semiconductor memory die, to receive the first plurality of data streams.

In some embodiments, a method performed at a first semiconductor memory die includes receiving an input data stream at a primary data interface during write operations, deserializing the input data stream into a plurality of data streams, and transmitting the plurality of data streams from a secondary data interface to one or more additional semiconductor memory die.

In some embodiments, a semiconductor memory die includes a primary data interface to receive an input data stream during write operations and to deserialize the input data stream into a first plurality of data streams, and also includes a secondary data interface, coupled to the primary data interface, to transmit the first plurality of data streams.

In some embodiments, a semiconductor memory system includes a first semiconductor package and a second semiconductor package stacked with the first semiconductor package in a package-on-package configuration. The first semiconductor package includes a first semiconductor memory die that includes a primary data interface to receive data during write operations and a secondary data interface, coupled to the primary data interface, to retransmit the data. The second semiconductor package includes a second semiconductor memory die that includes a secondary data interface, coupled to the secondary data interface of the first semiconductor memory die, to receive the retransmitted data.

In some embodiments, a method is performed in a first semiconductor die situated in a first semiconductor package. In the method, data is received at a primary data interface die during write operations. The data is retransmitted from a secondary data interface to one or more additional semiconductor memory die. The one or more additional semiconductor memory die include at least one additional semiconductor memory die in a second semiconductor package stacked with the first semiconductor package in a package-on-package configuration.

In some embodiments, a semiconductor package includes a semiconductor memory die that includes a primary data interface to receive data during write operations and a secondary data interface, coupled to the primary data interface, to retransmit the data. The semiconductor package also includes a package substrate on which the semiconductor memory die is mounted; a first conductive pad situated on a bottom side of the package substrate and coupled to the primary data interface, to provide the data to the primary data interface; and a second conductive pad situated on a top side of the package substrate and coupled to the secondary data interface, to convey at least a portion of the retransmitted data.

Reference will now be made in detail to various embodiments, examples of which are illustrated in the accompanying drawings. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the disclosure. However, some embodiments may be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of the embodiments.

FIG. 1 is a block diagram of a semiconductor memory system 100 that includes a master semiconductor memory die 102 a and one or more slave semiconductor memory die 102 b in accordance with some embodiments. (The term die as used herein may be either singular or plural, depending on the context.) In some embodiments, the memory die 102 a and 102 b are dynamic random-access memories (DRAM). The memory system 100 also includes a memory controller 114 coupled to the memory die 102 a and 102 b.

The master memory die 102 a includes a primary data (DQ) interface 104 a, a secondary data (DQ) interface 106 a, a command and address (C/A) interface 110 a, a mode configuration interface 112 a, and a memory core 108 a. The memory core 108 a includes an array of memory cells (e.g., DRAM cells) for storing data. Each slave memory die 102 b includes a secondary data (DQ) interface 106 b, a command and address (C/A) interface 110 b, a mode configuration interface 112 b, a memory core 108 b, and an optional primary data (DQ) interface 104 b, which is disabled. Each memory core 108 b, like the memory core 108 a, includes an array of memory cells (e.g., DRAM cells) for storing data.

The memory controller 114 transmits commands (e.g., memory access commands and their associated addresses) to the memory die 102 a and 102 b through a C/A bus 120. In the example of FIG. 1, the C/A bus 120 has a multi-drop, fly-by architecture. In some embodiments, the C/A bus 120 includes a separate chip-select (CS) signal line for each memory die 102 a and 102 b. Each CS signal line conveys a CS signal to its respective memory die 102 a or 102 b. A respective CS signal, when asserted, allows the corresponding memory die 102 a or 102 b to execute a command received over the C/A bus 120, and thus qualifies the command. For example, each memory die 102 a and 102 b may receive a command (e.g., a memory access command) in parallel, but only the memory die 102 a or 102 b for which the corresponding CS signal has been asserted performs the operation specified by the command. Each memory die 102 a and 102 b receives the C/A signals (including its CS signal) through its C/A interface 110 a or 110 b. In some embodiments, the C/A bus 120 from the memory controller may be received by an address buffer (e.g. an address register integrated circuit) that re-transmits the command and address information to the memory die 102 a and 102 b.

The primary data interface 104 a of the master memory die 102 a is coupled directly to the memory controller 114 by a data (DQ) signal line 116. The data signal line 116 provides data (e.g., an input data stream) from the memory controller 114 to the master memory die 102 a during write operations and provides data (e.g., an output data stream) from the master memory die 102 a to the memory controller 114 during read operations (e.g., during column access operations performed in response to a column access (CAS) command). The primary data interface 104 a is coupled within the master memory die 102 a to the secondary data interface 106 a. One or more (e.g., a plurality of) external data (DQ) signal lines 118 couple the secondary interface 106 a to the secondary interface 106 b of each slave memory die 102 b.

During write operations, the memory controller 114 transmits write data to the primary data interface 104 a over the signal line 116. The data received at the primary data interface 104 a is provided to the secondary data interface 106 a, which forwards the data to the secondary data interface 106 b of each slave memory die 102 b. In some embodiments, the data received at the primary data interface 104 a is deserialized into a plurality of data streams; the secondary data interface 106 a transmits the data streams to the secondary data interface 106 b of each slave memory die 102 b over respective signal lines 118. For example, the primary data interface 104 a receives write data from the memory controller 114 at double data rate (DDR) and deserializes the write data into two single-data-rate (SDR) data streams, which the secondary data interface 106 a transmits to the slave memory die 102 b over two signal lines 118. Each of the signal lines 118 conveys one of the SDR data streams. In some embodiments, write data is only provided from the primary data interface 104 a to the secondary data interface 106 a and forwarded to the slave memory die 102 b for write commands that are not directed to the master memory die 102 a. If a write command is directed to the master memory die 102 a (e.g., as indicated by assertion of the CS signal for the master memory die 102 a), the write data is provided to the memory core 108 a instead.

During read operations (e.g., column access operations) performed by a respective slave memory die 102 b, data is transmitted from the secondary data interface 106 b of the respective slave memory die 102 b to the secondary data interface 106 a of the master memory die 102 a. From there, the data is provided to the primary data interface 104 a and forwarded to the memory controller 114 over the signal line 116. In some embodiments, the data is transmitted from the secondary data interface 106 b to the secondary data interface 106 a in a plurality of data streams, which are serialized in the master memory die 102 a. The serialized data is then forwarded to the memory controller 114 over the signal line 116. For example, the secondary data interface 106 b transmits two SDR data streams to the secondary data interface 106 a, with each SDR data stream being transmitted over a respective signal line 118. The master memory die 102 a serializes the two SDR data streams into a single DDR output data stream that the primary data interface 104 a transmits onto the signal line 116.

In some embodiments, the data signal line 116 is one of a number of data signal lines that compose a data bus (or a portion of a data bus) coupling the memory controller 114 with the master memory die 102 a. The master memory die 102 a includes a separate primary data interface 104 a coupled to each data signal line of the data bus and a separate secondary data interface 106 a coupled to each primary data interface 104 a. Each slave memory die 102 b includes a separate secondary data interface 106 b coupled to a corresponding secondary data interface 106 a by one or more (e.g., two) signal lines 118. In some embodiments, each slave memory die 102 b also includes a number of primary data interfaces 104 b equal to the number of primary data interfaces 104 a; the primary data interfaces 104 b are disabled and are not connected to external signal lines. The data bus may also include one or more signal lines that convey data strobe (DQS) signals. For example, the data bus may include one data strobe signal line for every two data signal lines 116. A data strobe signal may be shared between multiple (e.g., two) primary data interfaces 104 a in the master memory die 102 a.

In some embodiments, the same die may be configured as either the master memory die 102 a or a slave memory die 102 b. If configured as a slave memory die 102 b, its primary data interfaces 104 b are disabled. In the example of FIG. 1, each die 102 a and 102 b is configured using a mode configuration interface 112 a or 112 b. The master memory die 102 a is configured as master by coupling its mode configuration interface 112 a to a power supply, while each slave memory die 102 b is configured as a slave by coupling its mode configuration interface 112 b to ground (or vice-versa). Other configuration methods include, but are not limited to, blowing fuses in the memory die 102 a and 102 b and programming configuration registers in the memory die 102 a and 102 b.

In some embodiments, the master memory die 102 a is configured to have a greater latency for providing data in response to read commands directed to it than the slave memory die 102 b, to ensure uniform latency from the perspective of the memory controller 114 regardless of the memory die 102 a or 102 b to which a read command is directed. For example, if buffering and retransmitting data from a slave memory die 102 b takes a specified number of clock cycles, the master memory die 102 a internally delays a read command directed to it by the same number of cycles, to ensure that the memory controller 114 receives read data in the same cycle, regardless of which memory die 102 a or 102 b performs the read operation. Similarly, in some embodiments the master memory die 102 a is configured to latch write data earlier than the slave memory die 102 b and to store the write data for a specified number of cycles (e.g., for a number of cycles equal to the delay in re-transmitting the write data from the master memory die 102 a to the slave memory die 102 b) before writing the data to its memory core 108 a. This delay ensures that write operations occur in the same clock cycle regardless of the memory die 102 a or 102 b to which they are directed.

The system 100 thus uses the master memory die 102 a to buffer data being transmitted between the memory controller 114 and slave memory die 102 b. This buffering allows the slave memory die 102 b to be coupled to the memory controller 114 without being directly connected to the memory controller 114 through data lines 116. The capacitive loading on the data lines 116 is reduced, which increases the maximum rate of data transmission in the system 100. The system 100 also avoids using data buffer integrated circuits (ICs) separate from the memory die 102 a and 102 b, thereby reducing cost and simplifying circuit board routing.

In some embodiments, the system 100 may include two or more memory die 102 a and/or 102 b stacked on a package substrate in a semiconductor package. Furthermore, the system 100 may include multiple semiconductor packages, each with multiple memory die 102 a and/or 102 b (e.g., multiple stacked memory die). In some embodiments, some or all of the multiple semiconductor packages are stacked in a package-on-package (POP) configuration.

FIG. 2A is a cross-sectional view of a system 200 in which four packages 202 a, 202 b, 202 c, and 202 d are stacked in a POP configuration and mounted on a module substrate 204 in accordance with some embodiments. The system 200 is an example of a portion of the system 100 (FIG. 1). In some embodiments, the module substrate 204 is the substrate of a dual-inline memory module (DIMM). Each of the packages 202 a-d includes two memory die 210-1 and 210-2 stacked on a package substrate 206. One of the memory die (e.g., the memory die 210-2 of the package 202 a, which is the bottommost memory die) is configured as the master memory die 102 a (FIG. 1). The other memory die (e.g., the die 210-1 of the package 202 a and the die 210-1 and 210-2 of the packages 202 b-d) are configured as slave memory die 102 b (FIG. 1).

Each of the packages 202 a-d also includes pins 208. (The term pin as used herein includes pins, balls, lands, bumps, micro-bumps, and any other contacts suitable for electrically connecting a semiconductor package to a circuit board or other underlying substrate.) Respective pins 208 connect each one of the packages 202 b-d to the package directly beneath it. The pins 208 of the package 202 a connect the package 202 a to the module substrate 204; the package 202 a is thus mounted directly on the module substrate 204. Signal lines (not shown) in the module substrate 204 couple the packages 202 a-d to a memory controller (not shown). In some embodiments, the memory controller is mounted on a circuit board separate from and coupled to the module substrate 204.

The configuration of the packages 202 a-d in the system 200 is called a 4×2 POP configuration. In general, a stack of m packages that each include n die is called an m×n POP configuration.

FIG. 2B is a cross-sectional view of a system 214 in which two packages 216 a and 216 b are stacked in a 2×4 POP configuration and mounted on a module substrate 204 in accordance with some embodiments. The system 214 is an example of a portion of the system 100 (FIG. 1). Each of the packages 216 a-b includes four memory die 218-1 through 218-4 stacked on a package substrate 206. One of the memory die (e.g., the memory die 218-4 of the package 216 a, which is the bottommost memory die) is configured as the master memory die 102 a (FIG. 1). The other memory die (e.g., the die 218-1 through 218-3 of the package 216 a and the die 218-1 through 218-4 of the package 216 b) are configured as slave memory die 102 b (FIG. 1). Each of the packages 216 a and 216 b also includes pins 208. The pins 208 of the package 216 b connect the package 216 b to the package 216 a beneath it. The pins 208 of the package 216 a connect the package 216 a to the module substrate 204.

FIG. 2C is a cross-sectional view of a system 220 in which a single package 222 that includes eight memory die 224-1 through 224-8 is mounted on a module substrate 204 in accordance with some embodiments. The system 220 is an example of a portion of the system 100 (FIG. 1). The eight memory die 224-1 through 224-8 are stacked on a package substrate 206, which is connected to the module substrate 204 by pins 208. One of the memory die (e.g., the memory die 224-8, which is the bottommost memory die) is configured as the master memory die 102 a (FIG. 1). The other memory die (e.g., the die 224-1 through 224-7) are configured as slave memory die 102 b (FIG. 1).

In some embodiments, the system 100 (FIG. 1) may include multiple semiconductor packages situated in different locations on a circuit board (e.g., a module substrate). Furthermore, each package may include multiple memory die 102 a and/or 102 b (e.g., multiple stacked memory die). Alternatively, each package may include a single memory die 102 a or 102 b (FIG. 1).

FIG. 2D is a cross-sectional view of a system 230 in which two semiconductor packages 232 a and 232 b are mounted on a module substrate 204 in accordance with some embodiments. The system 230 is an example of a portion of the system 100 (FIG. 1). The semiconductor packages 232 a and 232 b are situated opposite to each other on opposing sides of the module substrate 204 in a clam-shell configuration. Each of the packages 232 a and 232 b includes two stacked memory die 234-1 and 234-2. One of the memory die (e.g., the memory die 234-2 of the package 232 a) is configured as the master memory die 102 a (FIG. 1). The other memory die (e.g., the die 234-1 of the package 232 a and the die 234-1 and 234-2 of the package 232 b) are configured as slave memory die 102 b (FIG. 1).

FIG. 2E is a cross-sectional view of another system 236 (e.g., another example of a portion of the system 100, FIG. 1) in which two semiconductor packages 232 c and 232 d are mounted on a module substrate 204 in accordance with some embodiments. The semiconductor packages 232 c and 232 d are situated in adjacent sites on the same side of the module substrate 204. (Alternatively, the packages 232 c and 232 d may be situated in non-adjacent sites on the same side or opposite sides of the module substrate 204). For example, the packages 232 c and 232 d may be situated in adjacent sites in a row of semiconductor packages mounted on the module substrate 204. In another example, the module substrate 204 may include multiple rows of semiconductor packages, and the packages 232 c and 232 d may be situated in adjacent sites in a column of packages on the module substrate 204. Each of the packages 232 c and 232 d includes two stacked memory die 234-1 and 234-2. One of the memory die (e.g., the memory die 234-2 of the package 232 c) is configured as the master memory die 102 a (FIG. 1). The other memory die (e.g., the die 234-1 of the package 232 c and the die 234-1 and 234-2 of the package 232 d) are configured as slave memory die 102 b (FIG. 1).

FIG. 2F is a cross-sectional view of yet another system 240 (e.g., a portion of the system 100, FIG. 1) in which two semiconductor packages 242 a and 242 b are mounted on a module substrate 204 in accordance with some embodiments. The semiconductor packages 242 a and 242 b are situated opposite to each other on opposing sides of the module substrate 204 in a clam-shell configuration. Each of the packages 242 a and 242 b includes a single memory die 234. One of the memory die (e.g., the memory die 234 of the package 242 a) is configured as the master memory die 102 a (FIG. 1), while the other memory die (e.g., the die 234 of the package 242 b) is configured as slave memory die 102 b (FIG. 1).

FIG. 2G is a cross-sectional view of still another system 250 (e.g., a portion of the system 100, FIG. 1) in which two semiconductor packages 242 c and 242 d are mounted on a module substrate 204 in accordance with some embodiments. The semiconductor packages 242 c and 242 d are situated in adjacent sites (e.g., in the same row or column of semiconductor packages) on the same side of the module substrate 204. Each of the packages 242 c and 242 d includes a single memory die 234, one of which (e.g., the memory die 234 of the package 242 c) is configured as the master memory die 102 a (FIG. 1) and the other of which (e.g., the die 234 of the package 242 d) is configured as a slave memory die 102 b (FIG. 1).

FIG. 3 is a block diagram of a system 300 in which semiconductor packages containing semiconductor memory die are mounted on a module (e.g., a DIMM) 302 in accordance with some embodiments. A first plurality of semiconductor packages (or POP configurations) 304-1 through 304-9 is mounted on a first side (e.g., the bottom side) of the module 302 and a second plurality of semiconductor packages (or POP configurations) 306-1 through 306-9 is mounted on a second side (e.g., the top side) of the module 302. In some embodiments, each pair of packages 304-M and 306-M (where 1≦M≦9) are mounted opposite to each other on opposing sides of the module 302. While FIG. 3 shows an example in which each side of the module 302 includes nine packages, in general the number of packages mounted on the module 302 may vary.

In some embodiments, each package (or POP configuration) 304-M includes a master memory die 102 a (FIG. 1) and each package (or POP configuration) 306-M includes one or more slave memory die 102 b (FIG. 1). For example, each package 304-M and 306-M includes multiple memory die (e.g., multiple stacked memory die): each package 304-M includes a master memory die 102 a and one or more slave memory die 102 b, while each package 306-M includes multiple slave memory die 102 b. In one example, each package 304-M is an example of a package 232 a (FIG. 2D) and each package 306-M is an example of a package 232 b (FIG. 2D). Each pair of packages 304-M and 306-M (e.g., pair 304-1 and 306-1, pair 304-2 and 306-2, etc.) thus may be an example of the system 230 (FIG. 2D). In other examples, each package 304-M and 306-M includes a single memory die. For example, each package 304-M is an example of a package 242 a (FIG. 2F) and each package 306-M is an example of a package 242 b (FIG. 2F). Each pair of packages 304-M and 306-M (e.g., pair 304-1 and 306-1, pair 304-2 and 306-2, etc.) thus may be an example of the system 240 (FIG. 2F).

A memory controller (MC) 312 is coupled to the module 302. For example, the memory controller 312 may be mounted on a circuit board to which the module 302 is connected. A data bus 314 connects the memory controller 304 to the master memory die 102 a (FIG. 1) in the first plurality of semiconductor packages 304-1 through 304-9. In some embodiments, the data bus 314 includes a plurality of data signal lines (e.g., lines 116, FIG. 1), each of which is coupled to a respective primary data interface 104 a (FIG. 1) in one of the packages 304-1 through 304-9. The data bus 314 also may include data strobe signal lines. The data bus may include multiple groups of signal lines, with each group coupling the memory controller 114 to a respective one of the packages 304-1 through 304-9. In one example, each group of signal lines includes four data signal lines and two data strobe signal lines, with each of the four data signal lines being connected to a respective primary data interface 104 a (FIG. 1).

Data signal lines 308 (e.g., signal lines 118, FIG. 1) couple the secondary data interfaces 106 a (FIG. 1) of the master memory die 102 a (FIG. 1) of the packages 304-1 through 304-9 to secondary data interfaces 106 b of the slave memory die 102 b (FIG. 1) in the packages 306-1 through 306-9. Each package 304-M thus buffers data for a corresponding package 306-M. In some embodiments, the signal lines 308 are SDR data lines, while the data bus 314 is a DDR data bus. (If the packages 304-1 through 304-9 include one or more slave die 102 b, the secondary data interfaces 106 b of those slave die 102 b are coupled within each package to the secondary data interface 106 a of the corresponding master die 102 a.)

The memory controller 312 sends C/A signals to the packages 304-1 through 304-9 and 306-1 through 306-N via a plurality of C/A signal lines 316, which may be buffered by an optional buffer 310 on the module 302. In some embodiments, each memory die in a respective pair of packages 304-M and 306-M receives its own CS (i.e., chip select) signal, and corresponding memory die in different pairs of packages 304-M and 306-M receive the same CS signal. Commands (e.g., memory access commands) issued by the memory controller 312 are therefore performed in parallel by one memory die in each pair of packages 304-M and 306-M.

In the example of the system 300, the signal lines 308 couple packages 304-M and 306-M situated on opposite sides of the module 302. In other systems, signal lines (e.g., lines 118, FIG. 1) may couple packages on the same side of a module (e.g., such that respective pairs of packages on the same side of the module are examples of the system 236, FIG. 2E, or 250, FIG. 2G). In still other systems, each package or POP configuration on the module includes a master memory die 102 a as well as one or more slave memory die 102 b (FIG. 1), and the signal lines 308 are absent (e.g., such that each POP configuration is an example of a system 200, 214, or 220, FIGS. 2A-2C).

FIG. 4A is a schematic diagram of a system 400 in which two memory die 406 a and 406 b are stacked on a package substrate 404 that is mounted on a module substrate 402 in accordance with some embodiments. The first memory die 406 a is configured as a master memory die 102 a (FIG. 1), while the second memory die 406 b is configured as a slave memory die 102 b (FIG. 1). The package substrate 404 and die 406 a and 406 b compose a semiconductor package that is an example of a package 202 a (FIG. 2A), 232 a (FIG. 2D), or 232 c (FIG. 2E), while the module substrate 402 is an example of the module substrate 204 (FIG. 2A, 2D, or 2E).

The master memory die 406 a includes a primary data interface 104 a (FIG. 1), which includes a bond pad 416 a and buffers 422 and 424, and a secondary data interface 106 a (FIG. 1), which includes bond pads 418 a and 420 a. The slave memory die 406 b includes a primary data interface 104 b (FIG. 1), which includes a bond pad 416 b and buffers 422 and 424, and a secondary data interface 106 b (FIG. 1), which includes bond pads 418 b and 420 b. A primary bond pad 410 on the package substrate 402 is coupled to a data signal line 408 (e.g., signal line 116, FIG. 1) on the module substrate 402. The bond pad 416 a on the master memory die 406 a is wire-bonded to the primary bond pad 410 and thus coupled to the data signal line 408. The bond pad 416 b on the slave memory die 406 b is not bonded out, since the primary interface 104 b (FIG. 1) of the slave memory die 406 b is disabled. The bond pads 418 a and 418 b are each wire-bonded to a secondary bond pad 412 on the package substrate 404 and thus are coupled to each other. The bond pads 420 a and 420 b are similarly each wire-bonded to another secondary bond pad 414 on the package substrate 404 and thus coupled to each other. The secondary bond pads 412 and 414 thereby couple the secondary data interfaces 106 a and 106 b (FIG. 1) of the master memory die 406 a and slave memory die 406 b.

During write operations, the data signal line 408 provides an input data stream (e.g., DDR data) to the bond pad 416 a through the bond pad 410. The buffers 422 and 424 in the master memory die 406 a are clocked such that they deserialize the input data stream into first and second data streams (e.g., SDR data streams). The first data stream is provided from the buffer 422, through the bond pads 418 a and 412, to the bond pad 418 b of the slave memory die 406 b. The second data stream is provided from the buffer 424, through the bond pads 420 a and 414, to the bond pad 420 b of the slave memory die 406 b. The master memory die 406 a thus buffers data for the slave memory die 406 b. In some embodiments, the buffers 422 and 424 in the master memory die 406 a only forward data during write operations directed at the slave memory die 406 b; during write operations directed at the master memory die 406 a they are deactivated. The buffers 422 and 424 in the slave memory die 406 b are always deactivated in accordance with some embodiments.

The master and slave memory die 406 a and 406 b include respective mode configuration bond pads 428 a and 428 b that are part of respective mode configuration interfaces 112 a and 112 b (FIG. 1). Each mode configuration bond pad 428 a and 428 b is coupled to a power supply through an on-die resistor 430. In the system 400, the bond pad 428 a is wire-bonded to a pad 426 on the package substrate 404 that is connected to ground, thus putting a signal 432 in a logic-low state and instructing the memory die 406 a to configure itself as a master die. The bond pad 428 b is not bonded out and is thus pulled high by the resistor 430, putting the signal 432 in a logic-high state that instructs the memory die 406 b to configure itself as a slave die. (Alternatively, grounding a bond pad 428 a or 428 b may configure the corresponding memory die as a slave die, and not grounding the bond pad 428 a or 428 b may configure the die as a master die.)

FIG. 4B is a schematic diagram of a system 440 in which a master memory die 406 a is stacked with a slave memory die 406 b on a package substrate 404 a and is also coupled to slave memory die 406 c and 406 d stacked on another package substrate 404 b, in accordance with some embodiments. The master memory die 406 a is an example of a master die 102 a (FIG. 1), while the slave memory die 406 b-d are examples of slave die 102 b (FIG. 1). The packages substrates 404 a and 404 b are each an example of the package substrate 404 (FIG. 4A) and are mounted on a module substrate 442.

The memory die 406 a and 406 b are wire-bonded to the package substrate 404 a as described for FIG. 4A. The memory die 406 c and 406 d are wire-bonded to the package substrate 404 b such that they are both configured as slaves: although the mode configuration bond pad 428 c is wire-bonded to the bond pad 426 b, the bond pad 426 b is not connected to ground. Also, the bond pad 416 c in the primary data interface 102 b (FIG. 1) of the die 406 c is bonded to the primary bond pad 410 b of the package substrate 404 b, but the primary bond pad 410 b is not connected to the data signal line 408. The packages corresponding to the package substrates 404 a and 404 b are thus interchangeable: the die 406 a and 406 c may each serve as master or slave, depending on where the package substrates 404 a and 404 b are mounted on the module substrate 442. This interchangeability simplifies manufacturing.

During write operations, the buffers 422 and 424 in the master memory die 406 a deserialize the data received at the bond pad 416 a from the signal line 408 and primary bond pad 410 a, as described with respect to FIG. 4A. The buffer 422 provides a first data stream to the bond pad 418 a, from where it is transmitted through the bond pads 412 a and 418 b to the die 406 b, and through the bond pad 412 a, signal line 444, and bond pads 412 b, 418 c, and 418 d to the die 406 c and 406 d. The buffer 424 provides a second data stream to the bond pad 420 a, from where it is transmitted through the bond pads 414 a and 420 b to the die 406 b, and through the bond pad 414 a, signal line 446, and bond pads 414 b, 420 c, and 420 d to the die 406 c and 406 d. The signal lines 444 and 446 thus couple the secondary data interfaces 106 a and 106 b (FIG. 1) of the die 406 a-d and are examples of the signal lines 118 (FIG. 1).

FIG. 5A is a cross-sectional view illustrating wire-bonding in a semiconductor package 500 in accordance with some embodiments. The package 500 is an example of a package in the system 400 (FIG. 4A) or 440 (FIG. 4B). Two memory die 406 (e.g., 406 a and 406 b, or 406 c and 406 d, FIG. 4B) are stacked on a package substrate 404. A bond pad 416 (e.g., 416 a or 416 c, FIG. 4 b) on the die 406 a/c is wire-bonded to a primary bond pad 410 on the package substrate 404, while bond pads 418 (e.g., 418 a-b or 418 c-d, FIG. 4B) on the die 406 a/c and 406 b/d are wire-bonded to a secondary bond pad 412 on the package substrate 404. A signal line 502 in the package substrate 404 couples the bond pad 412 to a pin 208. In some embodiments, the pin 208 connects to the signal line 444 (FIG. 4B) when the package 500 is mounted on a module substrate 442 (FIG. 4B). Another signal line (not shown) may couple the bond pad 410 to another pin.

FIG. 5B is a cross-sectional view illustrating wire-bonding in a semiconductor memory system 510 in accordance with some embodiments. The system 510 is an example of the system 230 (FIG. 2D). Semiconductor packages 512 a and 512 b are mounted in a clam-shell configuration on a module substrate 204. Each package 512 a and 512 b includes two memory die 514 a and 514 b, or 514 c and 514 d, stacked on a package substrate 516 a or 516 b. The memory die 514 a is configured as a master memory die 102 a (FIG. 1), while the memory die 514 b-d are configured as slave memory die 102 b (FIG. 1).

Each package substrate 516 a and 516 b includes a central aperture to allow bond wires to be connected to the bottom die 514 a and 514 c. A bond wire 518 a couples a data signal line 524 (e.g., signal line 116, FIG. 1) to a primary data interface 104 a (FIG. 1) on the memory die 514 a. A bond wire 518 b connects to a primary data interface 104 b (FIG. 1) on the memory die 514 c but is not coupled to a signal line in the module substrate 204. A plurality of data signal lines 526 (e.g., signal lines 118, FIG. 1) couple together secondary data interfaces 106 a and 106 b (FIG. 1) on each die 514 a-d. Bond wires 520 a and 520 b respectively couple the die 514 a and 514 c to the signal lines 526, while bond wires 522 b and 522 d respectively couple the die 514 b and 514 d to the signal lines 526. Respective pins and signal lines in the packages 512 a and 512 b couple the signal lines 524 and 526 to respective bond wires.

FIG. 5C is a cross-sectional view illustrating wire-bonding in another semiconductor memory system 530 in accordance with some embodiments. The system 530 is an example of the system 236 (FIG. 2E) and is identical to the system 510 (FIG. 5B) except that the semiconductor packages 512 a and 512 b are mounted on the same side of the module substrate 204. A plurality of data signal lines 532 (e.g., signal lines 118, FIG. 1) (e.g., signal lines 444 and 446, FIG. 4B) couple together secondary data interfaces 106 a and 106 b (FIG. 1) on each die 514 a-d. Bond wires 520 a and 520 b respectively couple the die 514 a and 514 c to the signal lines 532, and bond wires 522 b and 522 d respectively couple the die 514 b and 514 d to the signal lines 532. Respective pins and signal lines in the packages 512 a and 512 b couple the signal lines 532 to respective bond wires.

In some embodiments, instead of using bond wires, through-die vias (e.g., through-silicon vias or TSVs) are used to couple secondary data interfaces 106 a and/or 106 b (FIG. 1) on different memory die 102 a and/or 102 b (FIG. 1). For example, FIG. 5D is a cross-sectional view of a system 550 in which packages 552 a and 552 b are mounted are mounted in a clam-shell configuration on a module substrate 204 in accordance with some embodiments. The system 550 is an example of the system 230 (FIG. 2D). Each package 552 a and 552 b includes two memory die 554 a and 554 b, or 554 c and 554 d, stacked on a package substrate 556 a or 556 b. The memory die 554 a is configured as a master memory die 102 a (FIG. 1), while the memory die 554 b-d are configured as slave memory die 102 b (FIG. 1). By analogy to the system 510 (FIG. 5B), a bond wire 518 a couples a data signal line 524 (e.g., signal line 116, FIG. 1) to a primary data interface 104 a (FIG. 1) of the master memory die 554 a. The secondary data interfaces 106 a and 106 b (FIG. 1) of the memory die 554 a-d, however, are coupled using through-die vias 558, along with interconnects 560, signal lines in the package substrates 556 a-b, and the signal lines 526 (e.g., signal lines 118, FIG. 1). FIG. 5D is merely one example of a system in which through-die vias are used to couple secondary data interfaces 106 a and/or 106 b (FIG. 1). Other examples are possible. For example, through-die vias may be used in any of the systems of FIGS. 2A-2E.

FIG. 6A is a cross-sectional exploded view of packages in a POP configuration (e.g., in systems 200 or 214, FIGS. 2A-2B), showing bond pads and pins associated with primary data interfaces 104 a and 104 b (FIG. 1) in accordance with some embodiments. Semiconductor packages 600 a and 600 b are stacked in a POP configuration. The package 600 a includes memory die 602 a and 602 b stacked on a package substrate 606 a. The package 600 b includes memory die 602 c and 602 d stacked on a package substrate 606 b. The memory die 602 a is configured as a master memory die 102 a (FIG. 1), while the memory die 602 b-d are configured as slave memory die 102 b (FIG. 1). A bond pad 604 a on the memory die 602 a is part of a primary data interface 104 a (FIG. 1). Bond pads 604 b-d on the memory die 602 b-d are parts of respective (disabled) primary data interfaces 104 b (FIG. 1).

The bond pad 604 a on the memory die 602 a is wire-bonded to a bond pad 608 a on the package substrate 606 a, which is coupled to a conductive pad 610 a on the bottom surface of the package substrate 606 a. The conductive pad 610 a is connected to a pin 208-1 that connects to a conductive pad 614 on the module substrate 204. The conductive pad 614 may be connected to a data signal line (not shown), such as the signal line 116 (FIG. 1), thus coupling the bond pad 604 a to the data signal line. The bond pad 604 b on the memory die 602 b is not bonded out. Because the memory die 602 b is a slave, its primary data interface 104 b (FIG. 1) and thus its bond pad 604 b are not used. Similarly, the bond pad 604 d on the memory die 602 d is not bonded out and not used.

The bond pad 604 c is bonded out in the same manner as the bond pad 604 a: it is wire-bonded to a bond pad 608 b on the package substrate 606 b, which is coupled to a conductive pad 610 b on the bottom surface of the package substrate 606 b. The conductive pad 610 b is connected to a pin 208-2 that connects to a conductive pad 612 a on the top of the package substrate 606 a. (A similar conductive pad 612 b is situated on top of the package substrate 606 b, allowing additional packages to be added to the POP stack). The conductive pad 612 b, however, is not coupled to the module substrate 204. The bond pad 604 c thus is not coupled to any signal lines in the module substrate 204, in accordance with the memory die 602 c's configuration as a slave.

FIG. 6B is another cross-sectional exploded view of the packages 600 a and 600 b, showing bonds pads and pins associated with secondary data interfaces 106 a and 106 b (FIG. 1) in accordance with some embodiments. A bond pad 620 a on the master memory die 602 a is part of a secondary data interface 106 a (FIG. 1). Bond pads 620 b-d on the memory die 602 b-d are parts of respective secondary data interfaces 106 b (FIG. 1). The bond pads 620 a and 620 b in the package 600 a are wire-bonded to a bond pad 622 a on the package substrate 606 a, which is coupled to a conductive pad 630 a on the bottom of the package substrate 606 a and a conductive pad 632 a on the top of the package substrate 606 a. Similarly, the bond pads 620 c and 620 d in the package 600 b are wire-bonded to a bond pad 622 b on the package substrate 606 b, which is coupled to a conductive pad 630 b on the bottom of the package substrate 606 b and a conductive pad 632 b on the top of the package substrate 606 b. A pin 208-4 connects the conductive pad 630 b to the conductive pad 632 a. In this manner the bond pads 620 a-d, and thus the secondary data interfaces 106 a and 106 b of the die 602 a-d, are coupled together. Furthermore, a pin 208-3 connects the conductive pad 630 a to a conductive pad 634 on the module substrate 204. The conductive pad 634 may be connected to a data signal line (not shown) that connects to secondary data interfaces 106 b in other packages.

Because the packages 600 a and 600 b are structurally identical and their die 602 a and 602 c each configurable as either master or slave, the packages 600 a and 600 b may be stacked in any order in a POP configuration. This flexibility simplifies manufacturing.

FIG. 7 is an exploded plan view of a POP configuration 700 in accordance with some embodiments. The POP configuration 700 includes four stacked package substrates 702 a-d, with two memory die 704 a and 704 b mounted in a stack on each of the package substrates 702 a-d. The POP configuration 700 is thus an example of a 4×2 POP configuration (e.g., in the system 200, FIG. 2A). The memory die 704 a on the package substrate 702 a is configured as a master memory die 102 a (FIG. 1) and the other memory die 704 a and 704 b are configured as slave memory die 102 b (FIG. 1).

Each of the package substrates 702 a-d includes a plurality of primary data (DQ) conductive pads 706 (e.g., conductive pads 610 a or 610 b, FIG. 6A) and a plurality of secondary conductive data pads 708 (e.g., conductive pads 630 a, 630 b, 632 a, and/or 632 b, FIG. 6B). Respective primary data conductive pads 706 are coupled to respective primary data interfaces 104 a (FIG. 1) on the memory die 704 a. The primary data conductive pads 706 of the package substrate 702 a are to be coupled to respective data signal lines 116 (FIG. 1) in an underlying circuit board substrate (e.g., module substrate 204, FIGS. 6A-6B). The primary data conductive pads 706 of the package substrates 702 b-d are not to be coupled to external data signal lines, since the corresponding primary data interfaces 104 b (FIG. 1) in the memory die 704 a on the substrates 702 b-d are not used. Respective secondary data conductive pads 708 on respective package substrates 702 a-d are coupled to each other (as indicated by the straight lines in the exploded view of FIG. 7) and to respective secondary data interfaces 106 a and 106 b (FIG. 1) of the memory die 704 a and 704 b.

In some embodiments, the memory die 704 a and 704 b include primary and secondary C/A interfaces configured analogously to the primary and secondary data interfaces 104 a and 104 b (FIG. 1). Each of the package substrates 702 a-d includes a plurality of primary C/A conductive pads 710 and a plurality of secondary C/A conductive pads 712. The primary C/A conductive pads 710 on each package substrate 702 a-d are coupled to respective bond pads in a primary C/A interface of the memory die 704 a on that package substrate. The secondary C/A conductive pads 712 on each package substrate 702 a-d are coupled to respective bond pads in a secondary C/A interface of the memory die 704 a and 704 b on that package substrate. The primary C/A interface on each memory die 704 a and 704 b is coupled to the secondary C/A interface on the same memory die.

In operation, the primary C/A conductive pads 710 on the package substrate 702 a receive C/A signals from C/A signal lines in an underlying circuit board (e.g., module) substrate and provide the C/A signals to the primary C/A interface of the memory die 704 a on the package substrate 702 a. This primary C/A interface forwards the C/A signals to the secondary C/A interface of the memory die 704 a on the package substrate 702 a. This secondary C/A interface forwards the C/A signals through the secondary C/A conductive pads 712 to the secondary C/A interfaces of the other memory die 704 a and 704 b in the configuration 700. The master memory die 704 a on the package substrate 702 a thus buffers C/A signals for the other memory die 704 a and 704 b. Latencies for the master memory die 704 a may be adjusted accordingly.

In some embodiments, a system that includes multiple die in a package and/or in a POP configuration may include one or more non-functional die. The ability to use a multi-die package that includes a non-functional die increases yield and thus decreases manufacturing costs. FIG. 8 is a cross-sectional view of a POP configuration 800 that includes non-functional die in accordance with some embodiments. The POP configuration 800 includes a stack of five packages 802 a-e, each of which includes two memory die 806 a and 806 b stacked on a package substrate 804. The memory die 806 a in the package 802 d and 806 b in the package 802 e are non-functional and thus not used to store data; instead, they are disabled. The memory die 806 a in the package 802 a is configured as a master memory die 102 a (FIG. 1) and the other functional memory die 806 a and 806 b are configured as slave memory die 102 b (FIG. 1). In some embodiments, the configuration 800 is implemented as illustrated for the configuration 700 (FIG. 7). Furthermore, the master memory die 806 a may shift CS signals so that respective CS signals are provided to respective functional die 806 a and 806 b and not to the non-functional die 806 a or 806 b. A memory controller coupled to the configuration 800 thus does not need to know which die are functional and which are non-functional.

In some embodiments, a master memory die 102 a (FIG. 1) transmits a data strobe (DQS) to slave memory die 102 b (FIG. 1) along with buffered data during write operations, as illustrated in FIGS. 9A-9C in accordance with some embodiments. FIG. 9A is a block diagram of a system 900 in which a first memory die 906 a is configured as a master memory die 102 a and a plurality 908 of memory die 906 b is configured as slave memory die 102 b. The memory die 906 a and 906 b are structurally identical and each one is configurable as either a master or slave memory die. A portion 904 of each die 906 a and 906 b includes a primary data interface 916 a/b and secondary data interface elements 914 a/b and 918 a/b. Secondary data interface elements 914 a and 918 a compose a secondary data interface 106 a (FIG. 1), while secondary data interface elements 914 b and 918 b compose a secondary data interface 106 b (FIG. 1). A portion 902 of each die 906 a and 906 b includes a primary data strobe interface 910 a/b and a secondary data strobe interface 912 a/b. The portion 904 is shown in an expanded view in FIG. 9B, while the portion 902 is shown in an expanded view in FIG. 9C. FIG. 10 shows timing diagrams for the system 900 during write operations in accordance with some embodiments.

(FIGS. 9A-9C show write-path circuitry for the system 900. Read-path circuitry for the system 900 is shown in FIGS. 11A-11C, as described below. In these figures, a signal line labeled “H” is biased at a logic-high level, a signal line labeled “L” is biased at a logic-low level, and a signal line labeled “nc” is unused in the path being shown—for example, it is tristated.)

A signal line 924 (e.g., signal line 116, FIG. 1) provides a DDR data signal DQ-P to a bond pad 932 a in the primary data interface 916 a. A signal line 920 provides an associated data strobe DQS-P to a bond pad 960 a in the primary strobe interface 910 a. DQ-P and DQS-P are received, for example, from a memory controller 114 (FIG. 1). The signal DQ-P includes a data bit A (FIG. 10) that is valid for a rising edge of DQS-P and a data bit B (FIG. 10) that is valid for a falling edge of DQS-P. A buffer 960 a in the primary strobe interface 910 a delays DQS-P by an amount t_(R-P), resulting in an internal strobe signal DS-P0 in the die 906 a. DS-P0 clocks a buffer 940 a in the primary data interface 916 a, which deserializes DQ-P into two SDR data streams D-P0 c (including bit A) and D-P0 d (including bit B). The buffer 940 a thus assigns bits of DQ-P to the data streams D-P0 c and D-P0 d in an alternating manner.

Skip circuits 948 and 950 transition the data streams D-P0 c and D-P0 d from a domain clocked by DS-P0 to a domain clocked by a clock signal CK-P0, resulting in data streams D-P0 e and D-P0 f. CK-P0 is offset from DS-P0 by a (potentially negligible) amount t_(SKWP). If the write operation is directed at the master die 906 a, multiplexers (“muxes”) 952 a and 954 a provide the data streams D-P0 e and D-P0 f to the memory core 908 a (e.g., core 108 a, FIG. 1), where the data is stored. If the write operation is directed to a slave die 906 b, however, then the data streams D-P0 e and D-P0 f are forwarded to the slave die 906 b. The data stream D-P0 e is provided to a buffer 938 a in the secondary data interface element 914 a, which drives a corresponding data stream DQ-SA onto a pad 930 a. The data stream D-P0 f is provided to a buffer 946 a in the secondary data interface element 918 a, which drives a corresponding data stream DQ-SB onto a pad 934 a. Also, the internal strobe signal DS-P0 is provided to a buffer 968 a in the secondary strobe interface 912 a, which drives a corresponding strobe signal DQS-S onto a pad 962 a. The buffer 968 a introduces a delay t_(T-P).

Data streams DQ-SA and DQ-SB are transmitted from the pads 930 a and 934 a, across signal lines 926 and 928 (e.g., signal lines 118, FIG. 1), to bond pads 930 b and 934 b in respective secondary data interface elements 914 b and 918 b. (The bond pad 932 b is not bonded out, because the primary data interface 916 b in the slave memory die 906 b is not used.) DQS-S is transmitted from the bond pad 962 a across a signal line 922 to a bond pad 962 b in the secondary strobe interface 912 b of the slave memory die 906 b. (The bond pad 960 b is not bonded out, because the primary strobe interface 910 b in the slave memory die 906 b is not used.) A buffer 966 b coupled to the bond pad 962 b generates an internal strobe signal DS-S1, which is delayed from DQS-S by an amount t_(R-S) DS-S1 clocks buffers 936 b and 944 b, which are coupled respectively to bond pads 930 b and 934 b and which output respective data streams D-S1 c and D-S1 d. Skip circuits 956 and 958 transition these data streams from a domain clocked by DS-S1 to a domain clocked by a clock signal CK-S1, resulting in data streams D-S1 e and D-S1 f. Muxes 952 b and 954 b forward D-S1 e and D-S1 f to the memory core 908 b (e.g., core 108 b, FIG. 1), where the data is stored.

FIGS. 9A-9C and 10 thus illustrate write operations in the system 900. Attention is now directed to read operations in the system 900. Read-path circuitry is shown in FIGS. 11A-11C and read-path timing is illustrated in FIG. 12 in accordance with some embodiments. During read operations performed by the master memory die 906 a, the memory core 908 a provides SDR data streams Q-P0 c and Q-P0 d in response to read commands (e.g., column access commands) directed to the master memory die 906 a. Q-P0 c includes a data bit A (FIG. 12) in a given clock cycle, while Q-P0 c includes a data bit B (FIG. 12) in the same clock cycle. Muxes 972 a and 974 a receive the data streams Q-P0 c and Q-P0 d and provide corresponding SDR data streams Q-P0 e and Q-P0 f to a buffer 942 a in the primary data interface 916 a. The buffer 942 a serializes Q-P0 e and Q-P0 f into a DDR data stream DQ-P, which is driven through the pad 932 a onto the signal line 924 (e.g., signal line 116, FIG. 1). DQ-P is transmitted, for example, to a memory controller 114 (FIG. 1). The primary strobe interface 910 a transmits a data strobe DQS-P to accompany DQ-P. A buffer 964 a in the primary strobe interface 910 a generates DQS-P based on a clock signal CK-P0 and drives DQS-P through the bond pad 960 a onto the signal line 920. DQS-P is offset from CK-P0 by an amount t_(T-P). The bits A and B are associated with respective rising and falling edges of DQS-P.

During read operations performed by a slave memory die 906 b, the core 908 b provides SDR data streams Q-S1 g and Q-S1 h in response to read (e.g., column access) commands directed to the slave memory die 906 b. Q-S1 g includes a data bit A in a given clock cycle, while Q-S1 h includes a data bit B in the same clock cycle. The data streams Q-S1 g and Q-S1 h are provided to buffers 938 b and 946 b in the secondary data interface elements 914 b and 918 b. (The core 908 a in the master memory die 906 a may similarly be coupled to buffers 938 a and 946 a, but these connections are not shown in FIGS. 11A and 11B for simplicity.) The buffers 938 b and 946 b drive corresponding data streams DQ-SA and DQ-SB through pads 930 b and 934 b onto signal lines 926 and 928 (e.g., signal lines 118, FIG. 1). At the same time, a buffer 968 b in the secondary strobe interface 912 b generates a strobe signal DQS-S from a clock signal CK-S1 and drives DQS-S through bond pad 962 b onto the signal line 922.

DQ-SA and DQ-SB are respectively received at bond pads 930 a and 934 a in the secondary data interface elements 914 a and 918 a of the master memory die 906 a and provided to respective buffers 936 a and 944 a. DQS-S is received at a bond pad 962 a in the secondary strobe interface 912 a of the master memory die 906 a and provided to a buffer 966 a, which generates a timing signal QS-P0 based on DQS-S. QS-P0, which is offset from DQS-S by an amount t_(R-P), is used to clock the buffers 936 a and 944 a, which output data streams Q-S1 e and Q-S1 f. Skip circuits 970 and 976 transition Q-S1 e and Q-S1 f from a domain clocked by QS-P0 to a domain clocked by a clock signal CK-P0, resulting in data streams Q-S1 c and Q-S1 d. Muxes 972 a and 974 a forward Q-S1 c and Q-S1 d to the buffer 942 a, which is clocked by CK-P0 and which serializes Q-S1 c and Q-S1 d into a DDR data stream DQ-P. DQ-P is transmitted along with a data strobe DQS-P, as previously described.

In some embodiments, timing for data transmission and reception in a master memory die 102 a and/or slave memory die 102 b (FIG. 1) is controlled using a delay-locked loop (DLL). For example, FIG. 13A illustrates write and read paths in a system 1300 in which both the master memory die 1302 a and slave memory die 1302 b include DLLs in accordance with some embodiments. The master memory die 1302 a receives a clock signal CK (e.g., at a clock input coupled to a clock pin), which is provided through input buffers 1328 to the input of a DLL 1322. The DLL 1322 generates a delayed clock signal Cdll based on CK. A feedback path associated with the DLL 1322 includes a first delay element 1324, which accounts for on-die delays and voltage and temperature (VT) variation of those delays, and a second delay element 1326, which accounts for a flight time Δt between the die 1302 a and 1302 b and also for CK path variation between the die 1302 a and 1302 b. While the delay elements 1324 and 1326 are shown as separate elements, their corresponding delays may be implemented in a single delay element.

In the write path of the system 1300, the master memory die 1302 a receives DDR data DQ_(pri) (e.g., from a memory controller 114, FIG. 1). Input buffers 1304 receive DQ_(pri) and provide it to flip-flops 1306 and 1308, which deserialize the data into two SDR data streams. The flip-flops 1306 and 1308 are clocked using a strobe signal DQS (e.g., as received from the memory controller 114, FIG. 1). Input buffers 1350 forward DQS to the flip-flops 1306 and 1308. The DQS signal provided to the flip-flop 1306 is inverted with respect to the DQS signal provided to the flip-flop 1308. The flip-flops 1306 and 1308 therefore sample data on alternating edges of DQS, thus deserializing DQ_(pri). The flip-flops 1306 and 1308 are part of a primary data interface 104 a (FIG. 1).

A domain crossing circuit 1312 (e.g., a skip circuit) transitions the SDR data streams to a domain clocked by Cdll, where flip-flops 1314 and 1316 latch the data in the respective streams. The domain crossing circuit 1312 is controlled by a compare circuit 1310, which compares CK and Cdll and generates a control signal (ctrl) accordingly. The output of flip-flops 1314 and 1316 is provided to output buffers 1318, which transmit the SDR data streams DQ_(secA) and DQ_(secB) to the slave memory device the master 1302 b. (If, however, a write operation is directed to the master memory die 1302 a, then taps 1320 provide the SDR data streams to the memory core of the master memory die 1302 a, and the buffers 1318 optionally do not forward the SDR data streams to the slave memory device 1302 b.) The flip-flops 1314 and 1316 and buffers 1318 are part of a secondary data interface 106 a (FIG. 1).

Input buffers 1352 in the slave memory die 1302 b receive the SDR data streams DQ_(secA) and DQ_(secB) and provide them to flip-flops 1358 and 1360, which latch the data during alternating clock cycle portions. The flip-flops 1358 and 1360 are clocked by CK, as provided by buffers 1354 and delayed by the delay circuit 1356. In some embodiments, the slave memory die 1302 b receives CK at a clock input coupled to a clock pin. CK as provided to the flip-flop 1358 is inverted with respect to CK as provided to the flip-flop 1360. The delay circuit 1356 (e.g., a controlled delay element, such as a digitally controlled delay line) accounts for the flight time Δt between the die 1302 a and 1302 b and also for the CK path variation between the die 1302 a and 1302 b.

In the read path of the system 1300, data from the memory core of the slave memory die 1302 b is latched by flip-flops 1368 and 1372 and then transmitted by output buffers 1370 and 1374 as SDR data streams DQ_(secA) and DQ_(secB) to the master memory die 1302 a. A DLL 1362 in the slave memory die 1302 b generates a clock signal Cdll based on CK. Cdll is used to clock the flip-flops 1368 and 1372, with Cdll as provided to the flip-flop 1372 being inverted with respect to Cdll as provided to the flip-flop 1368. A feedback loop for the DLL 1362 includes delay elements 1364 and 1366, which are analogous to delay elements 1324 and 1326.

In the master memory die 1302 a, the data streams DQ_(secA) and DQ_(secB) are forwarded through input buffers 1330 and muxes 1332 to flip-flops 1334 and 1336, which latch the data. (If, however, a read operation is directed to the master memory die 1302 a, then the muxes 1332 forward data from the core of the master memory die 1302 a instead.) The flip-flops 1334 and 1336 are clocked by opposite edges of CK. The data streams as output by the flip-flops 1334 and 1336 are provided to a domain crossing circuit (e.g., a skip circuit) 1338, which transitions the data streams to a domain clocked by Cdll. The domain crossing circuit 1338 is controlled by a compare circuit 1340, by analogy to compare circuit 1310 and domain cross circuit 1312. An output mux 1342, as clocked by Cdll, receives the data streams from the domain crossing circuit 1338 and serializes them by multiplexing them into a DDR data stream DQ_(pri). The output mux 1342 thus acts as a serializer. Output buffers 1344 transmit the DDR data stream (e.g., to a memory controller 114, FIG. 1). A mux 1346, which is also clocked by Cdll, provides a data strobe signal DQS to output buffers 1348, which transmit DQS alongside DQ_(pri).

The DLLs 1322 and 1362 in the system 1300 provide a constant latency for the secondary data interfaces in the die 1302 a and 1302 b and perform phase alignment that accounts for VT variation. The DLLs 1322 and 1362 allow for data buffering by the master memory die 1302 a without transmission of a data strobe between the master and slave memory die 1302 a and 1302 b.

FIG. 13B illustrates variations on the write path of the system 1300 in accordance with some embodiments. The master memory die 1302 a (FIG. 13A) is replaced with a master memory die 1376 a, which includes a decision-feedback equalizer (DFE) 1378 in its primary data interface 102 a (FIG. 1). The slave memory die 1302 b (FIG. 13A) is replaced with a slave memory die 1376 b, in which the delay circuit 1356 is coupled to the output of the DLL 1362 instead of the CK buffers 1354. The flip-flops 1358 and 1360 that latch the SDR data stream DQ_(secA) and DQ_(secB) are thus clocked by respective edges of Cdll as delayed by the delay circuit 1356.

FIG. 14A illustrates a system 1400 with an alternative write path to the write paths in the systems of FIGS. 13A and 13B in accordance with some embodiments. A master memory die 1402 a in the system 1400 includes an additional stage of flip-flops 1404 and 1406: the flip-flop 1404 is coupled between the flip-flop 1308 and the domain crossing circuit 1312, and the flip-flop 1406 is coupled between the flip-flop 1306 and the domain crossing circuit 1312. The flip-flops 1404 and 1406 are clocked by alternating edges of the clock signal CK, as provided by the clock input buffers 1328. In this example, the feedback path of the DLL 1322 includes the delay element 1324, which accounts for VT variation on the master memory die 1402 a, but does not include the delay element 1326 (FIG. 13A). Instead, the delay element 1356 in the slave memory die 1402 b accounts for flight time and clock path variation between the master memory die 1402 a and slave memory die 1402 b. The write path of the slave memory die 1402 b functions as described for the slave memory die 1302 b (FIG. 13A). Alternatively, as shown in the system 1410 in FIG. 14B, the delay element 1356 is omitted from the slave memory die 1412 b and the delay element 1326 is included in the master memory die 1412 a to account for flight time and clock path variation between the two die 1412 a and 1412 b.

In the examples of FIGS. 13A-13B and 14A-14B, domain-crossing is performed in the master memory die. In other embodiments, domain crossing is performed in the slave memory die. FIG. 15A illustrates a system 1500 in which flip-flops 1306 and 1308 in the primary data interface 104 a (FIG. 1) of a master memory die 1502 a deserialize DDR data DQ_(pri) into two SDR data streams DQ_(secA) and DQ_(secB), which are transmitted through output buffers 1506 to the slave memory die 1502 b, in accordance with some embodiments. The flip-flops 1306 and 1308 are clocked by alternating edges of a data strobe DQS, as provided by input buffers 1350. DQ_(pri) and DQS are received, for example, from a memory controller 114 (FIG. 1). The data streams DQ_(secA) and DQ_(secB) produced by the flip-flops 1306 and 1308 never transition to another clock domain within the master memory die 1502 a, and instead are transmitted to the slave memory die 1502 b in accordance with DQS. (If, however, a write operation is directed to the master memory die 1502 a and not to the slave memory die 1502 b, then taps 1504 provide the data streams to the memory core of the master memory die 1502 a and the output buffers 1506 may be disabled.) Also in the master memory die 1502 a, a flip-flop 1510 latches DQS and forwards DQS to internal control circuitry in accordance with a clock signal CK.

Input buffers 1512 in the slave memory die 1502 b receive DQ_(secA) and DQ_(secB) and provide them to flip-flops 1514 and 1516, which latch them on alternating edges of a delayed clock signal CK. CK as provided to the flip-flops 1514 and 1516 is delayed by a delay circuit (e.g., a controlled delay element, for example, a digitally controlled delay line) 1532, which introduces a phase delay as specified by a control signal from calibration logic 1530. The flip-flops 1514 and 1516 provide their respective data streams to flip-flops 1518 and 1520, which are clocked by alternating edges of the clock signal CK. Domain crossing to a CK domain thus occurs in the slave memory die 1502 b. A mux 1522 has inputs coupled to the outputs of flip-flops 1514 and 1518 and selects between these inputs based on a control signal from the calibration logic 1530. A mux 1524 similarly has inputs coupled to the outputs of flip-flops 1516 and 1520 and selects between these inputs based on the control signal from the calibration logic 1530. The data streams as output by the muxes 1522 and 1524 are forwarded on to the memory core of the slave memory die 1502 b.

An output buffer 1508 in the master memory die 1502 a transmits a data strobe DQSW_(sec), generated from the clock signal CK, that accompanies the data streams DQ_(secA) and DQ_(secB). Input buffers 1526 in the slave memory die 1502 b forward the data strobe to a flip-flop 1528, which is clocked by the delayed clock signal CK from the delay circuit 1532. The output of the flip-flop 1528 is provided to the calibration logic 1530, which adjusts the control signals for the delay circuit 1532 and muxes 1522 and 1544 accordingly.

FIG. 15B is a block diagram of an alternative system 1540 in which a slave memory die 1542 coupled to the master memory die 1502 a includes controlled delay elements (e.g., digitally controlled delay lines or DCDLs) 1544 and 1548 that replace the controlled delay element 1532 of the slave 1502 b (FIG. 15A) in accordance with some embodiments. The delay elements 1544 and 1548 are respectively coupled between the input buffers 1512 and the flip-flops 1546 and 1550. The delay elements 1544 and 1548 thus delay the arrival of the data streams DQ_(secA) and DQ_(secB) at the flip-flops 1546 and 1550, whereas the delay element 1532 (FIG. 15A) delays sampling of the data streams DQ_(secA) and DQ_(secB). The flip-flops 1546 and 1550 are clocked by CK as provided by the clock input buffers 1534. The slave memory die 1542 also includes a controlled delay element (e.g., a DCDL) 1552, coupled between the data strobe input buffers 1526 and the flip-flop 1554, to delay the data strobe. The delay elements 1544, 1548, and 1552 are controlled by the calibration logic 1530, based on the output of the flip-flop 1554 as provided to the calibration logic 1530.

Attention is now directed to methods of operating memory systems such as the memory system 100 (FIG. 1) and the variants of the system 100 that have been described above.

FIG. 16A is a flowchart of a method 1600 of performing write operations in a memory system (e.g., the system 100, FIG. 1) in accordance with some embodiments. The method 1600 is performed (1602) at a first memory die (e.g., a master memory die 102 a, FIG. 1).

In the method 1600, the first memory die receives (1604) data at a primary data interface (e.g., primary data interface 104 a, FIG. 1) during write operations. The data is received, for example, from a memory controller (e.g., controller 114, FIG. 1). In some embodiments, the data is received in an input data stream (e.g., a DDR data stream).

In some embodiments, the first memory die deserializes (1608) the input data stream into a plurality of data streams (e.g., into two SDR data streams).

The first memory die retransmits (1610) the data from a secondary data interface (e.g., secondary data interface 106 a, FIG. 1) to one or more additional semiconductor memory die (e.g., to one or more slave memory die 102 b, FIG. 1). In some embodiments, the plurality of data streams is transmitted (1612) from the secondary data interface to the one or more additional semiconductor memory die.

In some embodiments, the first semiconductor memory die is situated in a first semiconductor package and at least one of the additional semiconductor die is situated in a second semiconductor package stacked with the first semiconductor package in a package-on-package configuration. Examples of such configurations are shown in FIGS. 2A and 2B. The data is retransmitted (1614) from the first semiconductor package to the second semiconductor package. For example, at least a portion of the data is retransmitted through a contact (e.g., a conductive pad 632 a, FIG. 6B) connecting the first and second semiconductor packages.

FIG. 16B is a flowchart of a method 1650 of performing read operations in a memory system (e.g., the system 100, FIG. 1) in accordance with some embodiments. The method 1650 is performed (1652) at a first semiconductor memory die (e.g., a master memory die 102 a, FIG. 1) coupled to one or more additional semiconductor die (e.g., one or more slave memory die 102 b, FIG. 1).

During read operations directed at a respective semiconductor memory die of the one or more additional semiconductor memory die, the first semiconductor memory die receives (1654) data from the respective semiconductor memory die at a secondary data interface (e.g., secondary data interface 106 a, FIG. 1). In some embodiments, a plurality of data streams (e.g., two SDR data streams) is received (1656).

In some embodiments, the first semiconductor memory die is situated in a first semiconductor package and the respective semiconductor die is situated (1658) in a second semiconductor package stacked with the first semiconductor package in a package-on-package configuration. Examples of such configurations are shown in FIGS. 2A and 2B. The first package receives the data from the second package. For example, the first semiconductor package receives the data through one or more contacts (e.g., conductive pads 630 b and 632 a, FIG. 6B) connecting the first semiconductor memory die to the respective semiconductor memory die.

In some embodiments, the first semiconductor memory die serializes (1660) the plurality of data streams into an output data stream (e.g., into a DDR data stream).

The first semiconductor memory die transmits (1662) the data (e.g., the output data stream) from a primary data interface (e.g., primary data interface 104 a). The data is transmitted, for example, to a memory controller (e.g., controller 114, FIG. 1).

While the methods 1600 and 1650 include a number of operations that appear to occur in a specific order, it should be apparent that the methods 1600 and 1650 can include more or fewer operations, which can be executed serially or in parallel. Two or more operations may be combined into a single operation.

The foregoing description, for purpose of explanation, has been described with reference to specific embodiments. However, the illustrative discussions above are not intended to be exhaustive or to limit all embodiments to the precise forms disclosed. Many modifications and variations are possible in view of the above teachings. The disclosed embodiments were chosen and described to best explain the underlying principles and their practical applications, to thereby enable others skilled in the art to best implement various embodiments with various modifications as are suited to the particular use contemplated. 

What is claimed is:
 1. A memory module comprising: a substrate; memory including a first memory device, the first memory device having a primary interface for carrying out signal transfers with a memory controller via a primary bus, and a secondary interface; a second memory device, the second memory device including a data interface coupled to the secondary interface; wherein the memory is coupled to the substrate; and wherein data transfers between the second memory device and the memory controller are routed through the first memory device.
 2. The memory module according to claim 1, wherein the first memory device is configured as a buffer device, and the second memory device is configured as a memory storage device.
 3. The memory module according to claim 1, wherein the first memory device and the second memory device comprise dynamic random access memory (DRAM) devices.
 4. The memory module according to claim 3, wherein the first memory device is configured as a buffer device, and the second memory device is configured as a memory storage device.
 5. The memory module according to claim 4, wherein the first memory device is stacked with the second memory device in a chip package.
 6. The memory module according to claim 5, further comprising: plural second memory devices coupled to the first memory device in a multi-drop configuration within the chip package.
 7. The memory module according to claim 5, wherein the memory comprises: plural first memory devices; plural second memory devices, at least one second memory device stacked with a first memory device in respective chip packages; and wherein the memory comprises at least two of the respective chip packages mounted on the substrate.
 8. The memory module according to claim 7, wherein: the at least two of the respective chip packages are mounted on opposite sides of the substrate.
 9. The memory module according to claim 7, wherein: the at least two of the respective chip packages are mounted to the substrate in a package-on-package (POP) configuration.
 10. A memory module comprising: a substrate; memory coupled to the substrate, the memory including a first memory die, wherein in a first mode, the first memory die is configured as a buffer device to buffer data transfers between a memory controller and at least one second memory die; and in a second mode, the first memory die is configured as a storage device to store data associated with a data transfer between the memory controller and the first memory die.
 11. The memory module according to claim 10, wherein the first memory die and the at least one second memory die are stacked in a common package.
 12. The memory module according to claim 10, wherein the first memory die and the at least one second memory die comprise dynamic random access memory (DRAM) devices.
 13. The memory module according to claim 10, wherein the memory includes: plural first memory devices; plural second memory devices, at least one second memory device stacked with a first memory device in respective chip packages; and wherein the memory comprises at least two of the respective chip packages mounted on the substrate.
 14. The memory module according to claim 13, wherein: the at least two of the respective chip packages are mounted in a package-on-package (POP) configuration.
 15. The memory module according to claim 13, wherein: the at least two of the respective chip packages are mounted on opposite sides of the substrate.
 16. A method of operation in a memory module, the memory module including a substrate, a first memory device and a second memory device coupled to the substrate, the method comprising: operating the first memory device as a buffer device; operating the second memory device as a memory storage device; and buffering data transfers between the second memory device and a memory controller, the buffering carried out by the first memory device.
 17. The method according to claim 16, wherein the first memory device includes a primary interface and a secondary interface, and wherein the buffering includes: communicating with a memory controller via the primary interface; and communicating with the second memory device via the secondary interface.
 18. The method according to claim 17, wherein the buffering further comprises: communicating with plural second memory devices stacked with the first memory device.
 19. The method according to claim 18, wherein the buffering further comprises: communicating with the plural second memory devices via a multi-drop bus.
 20. The method according to claim 16, further comprising: storing data in the second memory device. 